CAE FEA Page 150

工程仿真软件和服务的全球领先供应商MSC.Software今日宣布推出MD Adams 2010 64位新版本，用户可以即刻下载。该增强版本主要提高了建模和分析方面的性能，使用户能够进行机械系统中更广泛、更可行的多学科分析。 MSC.Adams和MD Adams是全球使用最为广泛、最受信赖的解决方案，占据了全球该CAE分析领域绝大部分的市场份额，并广泛应用于汽车、航天、国防、医学、风力能源、包 装货物等行业的工程系统动力学。在此优越基础上，MSC.Software在新版MD Adams中进一步实施了现代化的C++ 解算器，改进了存储利用，并增强了有限元分析(FEA)的集成。经证明，这些改进使得大模型的读取速度提高95%，并且在同类模型运行分析方面，CPU性 能提高53%。案例显示，利用FEA的弹性体解决实际多学科问题时，该新版本比老版本的速度提高了700%，令人惊叹。 MD Adams新版本的其他重要改进包括： · Adams/Car插件模块，可以用于卡车建模和分析 · Adams/Car工具，通过轮胎和绝缘体的测试数据容易地定义模型参数 · Embedded Simulink S-Function可以通过外部系统库(External System Library)控制模型 · 从动态工作点导出Adams模型，再导入Nastran FEA · 后处理自动化支持，提高用户效率 · 为弹性体接触的壳体元素提供支持 · 对圆柱体、椭球体和盒子进行本地接触探测 Product:MSC MD ADAMS 2010 Win64 Lanaguage:English Platform:/Win64 Size:424.92G

PVTsim 19.0 released Updates and Bug fixes from PVTsim 18 to 19 New Options/Models PVT simulation options extended with Equilibrium Contact experiment. Updates and Bug Fixes General Tested on Windows Server 2008 and Windows 7 and installation guide updated. CSP viscosity model improved for P > 1000 bar. No longer possible to import fld-type databases (format used until version 13). API correlation for interfacial tension between hydrocarbon and water replaced by Firoozabadi and Ramey (1988). 5 mercaptanes added to the pure component database Methyl-mercaptane Ethyl-mercaptane Methyl-ethyl-sulfide Di-Methyl -sulfide Di-Ethyl-sulfide Fluid Management When characterizing multiple fluids to the same pseudo-components (Viscosity Tuning and Same Pseudos options) a master fluid composition is saved in addition to the individual fluids. The master fluid...

This is the latest full release of the Oasys Suite (PRIMER, D3PLOT, T/HIS, REPORTER & SHELL). 9.4.1 is a bug fix version of 9.4 (there have been no new features added between 9.4 and 9.4.1). Enhancements (for 9.4) and bug fixes are detailed in the release notes below, and 9.4 new features are explained fully in the PDF documents below. The 9.4.1 software has been thoroughly tested through our QA procedures. Release notes detailing the changes from 9.3.1 to 9.4, and 9.4 to 9.4.1 can be found here. DOWNLOAD OASYS 9.4.1 The 9.4 software requires a new licensing file if updating from 9.3 or previous. A new licensing file is not required if updating from 9.4 to 9.4.1. For more...

Turbo Package Analyzer (TPA) provides the package extraction and automation capability needed to address the electrical requirements of today\’s complex high-performance SiP, chip-scale, flip-chip, ball-grid array, and wire-bond. With TPA, IC and package designers of analog/RF and high-speed digital applications are able to fully characterize an entire package structure and automatically extract lumped or distributed RLC values for use with Nexximproduct:Ansoft TPA 5.0 Lanaguage:english Platform:Winxp/Win7 Size:71MB

Turbo Package Analyzer (TPA) provides the package extraction and automation capability needed to address the electrical requirements of today\’s complex high-performance SiP, chip-scale, flip-chip, ball-grid array, and wire-bond. With TPA, IC and package designers of analog/RF and high-speed digital applications are able to fully characterize an entire package structure and automatically extract lumped or distributed RLC values for use with Nexximproduct:Ansoft TPA 5.0 Lanaguage:english Platform:Winxp/Win7 Size:71MB

COMSOL Multiphysics 4.0 – modeling package, which solves the system of nonlinear differential equations in partial derivatives of the finite element method in one, two and three dimensions. It can meet the challenges of the field of electromagnetism, elasticity, fluid dynamics and gas dynamics. COMSOL also provides an opportunity to solve the problem as a mathematical formulation (in the form of equations) and physical (the choice of physical models, eg models of the diffusion process). Certainly, in any case will be solved system of equations, and the difference lies only in the possibility of using the physical system of units and physical terminology. The so-called physical mode, you can also use pre-defined equations for the majority of the phenomena taking...

Products What is PHOENICS? It is a proven, reliable cost-effective and easy-to-use tool which simulates processes involving fluid flow, heat or mass transfer, chemical reaction and combustion in engineering equipment and the environment. PHOENICS is used in nearly every branch of engineering and science in which fluid flow plays a key role:- Aerospace Automotive Chemical Combustion Electronics Cooling Metallurgical Power Generation TurbomachineryProduct:PHOENICS 2009.0 Lanaguage:english Platform:Winxp/Win7 Size:629MB

Pipe Flow Expert is our premier software application for designing and analyzing complex pipe networks where the flows and pressures must be balanced to solve the system. Its features include: A Robust Calculation Engine that will solve complex pipe networks An Intuitive User Interface that is best-in-class & easy to use Modeling of up to 1000 nodes and 1000 pipes. A Fluid Database with common liquid and gas data A Pipe Database with common pipe materials and sizes A Fittings Database with common valve and fitting data Overview Pipe Flow Expert is designed to help today抯 engineers analyze and solve a wide range of problems where the flow and pressure losses throughout a pipe network must be determined. The Pipe...

PExprt speeds the design and optimization process of transformers and inductors. Using a combination of classical and Finite Element Analysis (FEA) techniques, PExprt determines the appropriate core size and shape, air gaps, and winding strategy of a design. Users can then achieve optimum reliability and performance of the magnetic component efficiently by eliminating prototyping iterations. What’s new in v6?   Integrated magnetics and planar component modeling Thermal calculations Radiation and convection on the window Automatic generation of equivalent thermal model for Simplorer? Graphical representation of the thermal distribution in the window Winding-loss, magnetizing and leakage inductance calculations using FEA Core-loss calculations based on nonlinear core models Expanded core libraries Open-circuit and short-circuit tests Energy Losses Current density Flux-distribution maps Energy-distribution...

NEi Nastran is a powerful Finite Element Analysis solver with an integrated graphical user interface and model Editor which is used to analyze linear and nonlinear stress, dynamics, and heat transfer characteristics of structures and mechanical components. NEi Nastran  represents the latest in FEA technology with one of the fastest iterative solvers on the market along with accurate solutions that have been trusted for over 15 years by companies in all major industrial categories. NEi Nastran is available on a wide variety of platforms including 32-bit and 64-bit Windows and Linux operating systems. NEi Nastran comes in five modules (L1-L5) and a model Editor. NEi Nastran uses the latest in solver technology providing fast results for the largest and most...