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COMSOL.Multiphysics.5.4.0.295

COMSOL.Multiphysics.5.4.0.295

COMSOL Multiphysics® version 5.4 features new modeling tools, important performance improvements, a new Composite Materials Module, and COMSOL Compiler™ for creating standalone simulation applications and digital twins. Using COMSOL Compiler™, applications created with the Application Builder can be compiled and distributed as executable files for anyone to use without license file restrictions.

List of Release Highlights Updates

Core Functionality

  • New product: COMSOL Compiler™
  • More than one Parameter node in the Model Builder
  • Group Model Builder nodes into folders
  • Coloring of models based on selections
  • Faster solution time in the Windows® operating system

Electromagnetics

  • Fully parametric and ready-to-use parts for coils and magnetic cores
  • Electric currents and Joule heating in thin, layered structures
  • More than 40 new substrate materials for printed RF, microwave, and millimeter-wave circuits
  • New boundary conditions for thin metallic layers and antireflective coatings
  • Schrödinger-Poisson Equation interface for semiconductor simulations
  • New and updated Part Library for ray optics
  • More powerful STOP analysis
  • Optical dispersion models for ray optics

Structural Mechanics and Acoustics

  • New product: Composite Materials Module
  • Shock response spectrum analysis
  • Material activation for additive manufacturing
  • Microstructure modeling based on unit cells
  • Axisymmetric shells
  • Soft connectors
  • FSI for shells, membranes, structural assemblies, and multibody dynamics
  • Mullins effect for rubber
  • Damage models for brittle materials such as concrete
  • Acoustic ports
  • Nonlinear acoustic Westervelt computations

Product:COMSOL.Multiphysics.5.4.0.295
Lanaguage:english
Platform:Win7/WIN10
Size:1DVD

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