COMSOL.Multiphysics.5.4.0.295
COMSOL Multiphysics® version 5.4 features new modeling tools, important performance improvements, a new Composite Materials Module, and COMSOL Compiler™ for creating standalone simulation applications and digital twins. Using COMSOL Compiler™, applications created with the Application Builder can be compiled and distributed as executable files for anyone to use without license file restrictions.
List of Release Highlights Updates
Core Functionality
- New product: COMSOL Compiler™
- More than one Parameter node in the Model Builder
- Group Model Builder nodes into folders
- Coloring of models based on selections
- Faster solution time in the Windows® operating system
Electromagnetics
- Fully parametric and ready-to-use parts for coils and magnetic cores
- Electric currents and Joule heating in thin, layered structures
- More than 40 new substrate materials for printed RF, microwave, and millimeter-wave circuits
- New boundary conditions for thin metallic layers and antireflective coatings
- Schrödinger-Poisson Equation interface for semiconductor simulations
- New and updated Part Library for ray optics
- More powerful STOP analysis
- Optical dispersion models for ray optics
Structural Mechanics and Acoustics
- New product: Composite Materials Module
- Shock response spectrum analysis
- Material activation for additive manufacturing
- Microstructure modeling based on unit cells
- Axisymmetric shells
- Soft connectors
- FSI for shells, membranes, structural assemblies, and multibody dynamics
- Mullins effect for rubber
- Damage models for brittle materials such as concrete
- Acoustic ports
- Nonlinear acoustic Westervelt computations
Product:COMSOL.Multiphysics.5.4.0.295
Lanaguage:english
Platform:Win7/WIN10
Size:1DVD