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Ansoft Maxwell v14.02

ANSYS Maxwell® is the premier electromagnetic field simulation software for engineers tasked with designing and analyzing 3-D and 2-D electromagnetic and electromechanical devices such as motors, actuators, transformers, sensors and coils. Maxwell uses the accurate finite element method to solve static, frequency-domain and time-varying electromagnetic and electric fields. A key benefit of Maxwell is its automated solution process where users are only required to specify geometry, material properties and the desired output. From this point, Maxwell will automatically generate an appropriate, efficient and accurate mesh for solving the problem. This proven automatic adaptive meshing process removes complexity from the analysis process and allows engineers to benefit from a highly-efficient, easy-to-use design flow. View larger image A key feature in Maxwell...

Ansoft Simplorer 9.7

ANSYS Simplorer is a multi-domain system simulation software program. It is used for the design, modeling, analysis and optimization of high-performance systems that include electrical, thermal, electromechanical, electromagnetic, and hydraulic designs. These complex systems are commonly found in the automotive, aerospace/defense, and industrial automation industries. Simplorer provides a wide range of modeling techniques, analysis capabilities, and post processing. This enables the engineer to investigate system functionality, performance, and overall design verification. The result is a dramatic reduction in development time and cost, increased system reliability and system optimization. Simplorer – HFSS CouplingSimplorer V9.0 provides a new link to HFSS, the industry-standard simulation tool for 3D full-wave electromagnetic field simulation. Electromechanical engineers can use HFSS to design high-speed components including on-chip...

Ansoft Q3D Extractor 10.2

ANSYS Q3D Extractor is the premier 3-D and 2-D parasitic extraction software tool for engineers designing PCBs, electronic packaging and power electronic equipment. Q3D Extractor uses method of moments (integral equations) and FEMs to compute capacitive, conductance, inductance, and resistance matrices. It uses the fast multipole method (FMM) to accelerate the solution of the integral equations. Outputs from the solver include current and voltage distributions, CG and RL matrices. Q3D Extractor efficiently performs the 3-D and 2-D electromagnetic field simulation required for the extraction of resistance, conductance, partial inductance and capacitance RLCG parameters from a design and automatically generates a netlist in many formats, including SML (Simplorer format) and SPICE. Q3D Extractor is capable of generating S-parameters exported using the...

Ansoft Links v5.0

AnsoftLinks streamlines the transfer of design databases from popular third-party EDA layout tools into ANSYS electromagnetic, thermal and mechanical simulation products. EDA links are available for a number of tools offered by Cadence®, Zuken, Sigrity, Altium, and Mentor Graphics®. AnsoftLinks allows the user to select individual electronic components or complete designs of ICs, electronic packages and printed circuit boards. Designs are automatically converted into ready-to-simulate model thereby allowing engineers to accurately simulate existing ECAD geometries in their ANSYS software. New in AnsoftLinks 5.0 * AnsoftLinks for Solver on Demand * ClipDesign binary to cut dielectrics/planes * More efficient solid model generation * Ability to specify a minimum edge length for traces, planes and pads * Unite nets and keep solderballs,...

Ansoft HFSS v13

Engineers rely on the accuracy, capacity, and performance of HFSS to design high-speed components including on-chip embedded passives, IC packages, PCB interconnects, and high-frequency components such as antennas, RF/microwave components, and biomedical devices. With HFSS, engineers can extract parasitic parameters (S, Y, Z), visualize 3D electromagnetic fields (near- and far-field) and generate Full-Wave SPICE™ models that link to circuit simulations. Signal Integrity engineers\’ use HFSS within established EDA design flows to evaluate signal quality, including transmission path losses, reflection loss due to impedance mismatches, parasitic coupling and radiation. ANSYS Workbench Integration:– Add-in capability for HFSS and HFSS-IE designs– Full range of HFSS capabilities available within a Workbench project, includingscripting support– Data integration with DesignXplorer, ANSYS Mechanical thermal analysis – Transient...

Ansoft Maxwell v14

Maxwell® is the premier electromagnetic field simulation software for engineers tasked with designing and analyzing 3-D and 2-D electromagnetic and electromechanical devices such as motors, actuators, transformers, sensors and coils. Maxwell uses the accurate finite element method to solve static, frequency-domain and time-varying electromagnetic and electric fields. A key benefit of Maxwell is its automated solution process where users are only required to specify geometry, material properties and the desired output. From this point, Maxwell will automatically generate an appropriate, efficient and accurate mesh for solving the problem. This proven automatic adaptive meshing process removes complexity from the analysis process and allows engineers to benefit from a highly-efficient, easy-to-use design flow. A key feature in Maxwell is the ability to...

Ansoft Maxwell v14

Maxwell® is the premier electromagnetic field simulation software for engineers tasked with designing and analyzing 3-D and 2-D electromagnetic and electromechanical devices such as motors, actuators, transformers, sensors and coils. Maxwell uses the accurate finite element method to solve static, frequency-domain and time-varying electromagnetic and electric fields. A key benefit of Maxwell is its automated solution process where users are only required to specify geometry, material properties and the desired output. From this point, Maxwell will automatically generate an appropriate, efficient and accurate mesh for solving the problem. This proven automatic adaptive meshing process removes complexity from the analysis process and allows engineers to benefit from a highly-efficient, easy-to-use design flow. A key feature in Maxwell is the ability to...

Ansoft Simplorer 8.1

New in Simplorer v8.1 * ANSYS Icepak® and ANSYS Mechanical® coupling * State Space Modeling Capability * Simplorer stand alone or Maxwell Transient co-simulation Saved States * Set Assignments * Dynamic Updates for Plots * Enhanced \”Output Dialog\” window * Evaluated Value display on schematic * Sub-Circuit Buses * Library Management Enhancements Simplorer stand alone or Maxwell Transient co-simulation Saved StatesIn Simplorer v8.1 users can save states in a standalone simulation or across the co-simulation interface with Maxwell. This will enable the user to end a simulation and then continue it from the ending state. An example would be where a user would like to simulate a system to a certain operating point, then use that point to continue the...

Ansoft Maxwell v13

Maxwell V13.0 and RMxprt V13.0 contain many new capabilities and enhancements as:ANSYS Workbench Couplings * Thermal Coupling (one-way and two-way) * Structural Coupling (one-way) * Design Exploration Coupling New Capabilities * New Adaptive Mesh Refinement for 3D Eddy Solve * 3D-Transient Cosimulation with Simplorer * Expand Demagnetization to 3rd Quadrant * Magnetization Capability * Functional Magnetization Direction * Transient Solid Winding Source with More Than Two Terminals * Speed up of the C-matrix calculation in 3D electrostatic * New UDP Components * New Slot Editor * New Machine Type * New Modeler Capabilities Improved Performance * Speed Up 3D Transient * Better nonlinear iteration algorithm * Enhanced volume mesher (TAU mesher) reducing total number of nonlinear iterations * Introduce damping...

Ansoft TPA 5.0

Turbo Package Analyzer (TPA) provides the package extraction and automation capability needed to address the electrical requirements of today\’s complex high-performance SiP, chip-scale, flip-chip, ball-grid array, and wire-bond. With TPA, IC and package designers of analog/RF and high-speed digital applications are able to fully characterize an entire package structure and automatically extract lumped or distributed RLC values for use with Nexximproduct:Ansoft TPA 5.0 Lanaguage:english Platform:Winxp/Win7 Size:71MB

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