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Turbo Package Analyzer (TPA) provides the package extraction and automation capability needed to address the electrical requirements of today\’s complex high-performance SiP, chip-scale, flip-chip, ball-grid array, and wire-bond. With TPA, IC and package designers of analog/RF and high-speed digital applications are able to fully characterize an entire package structure and automatically extract lumped or distributed RLC values for use with Nexximproduct:Ansoft TPA 5.0 Lanaguage:english Platform:Winxp/Win7 Size:71MB

PExprt speeds the design and optimization process of transformers and inductors. Using a combination of classical and Finite Element Analysis (FEA) techniques, PExprt determines the appropriate core size and shape, air gaps, and winding strategy of a design. Users can then achieve optimum reliability and performance of the magnetic component efficiently by eliminating prototyping iterations. What’s new in v6?   Integrated magnetics and planar component modeling Thermal calculations Radiation and convection on the window Automatic generation of equivalent thermal model for Simplorer? Graphical representation of the thermal distribution in the window Winding-loss, magnetizing and leakage inductance calculations using FEA Core-loss calculations based on nonlinear core models Expanded core libraries Open-circuit and short-circuit tests Energy Losses Current density Flux-distribution maps Energy-distribution...

Maxwell® is the leading electromagnetic field simulation software used for the design and analysis of 3D/2D structures, such as motors, actuators, transformers and other electric and electromechanical devices common to automotive, military/aerospace, and industrial systems. Based on the Finite Element Method (FEM), Maxwell accurately solves static, frequency-domain and time-varying electromagnetic and electric fields. Maxwell v12 improves engineering productivity, reduces development time, and assures first-pass design success. New Distributed Solve and multi-processing enhancements allow users to solve very complex, electromagnetically large geometry faster and to expand beyond what they ever thought possible with simulation technology. Additionally, Maxwell v12 includes new automation features, user-interface refinement, and data linking capability, making it easy to design, simulate, and validate complex, high-performance electromechanical and electromagnetic...

ANSYS, Inc. (NASDAQ: ANSS), a global innovator of simulation software and technologies designed to optimize product development processes, today announced its Ansoft Designer(R) 5.0.2 and Nexxim(R) 5.0.2 products. This engineering simulation platform and integrated technology supports Simulation Driven Product Development(TM) of electronic products. Powerful new features have been added to these latest versions that compress the electronic design and analysis cycle. For example, links with ANSYS(R) DesignXplorer(TM) software enable design of experiments, sensitivity studies and six-sigma design. Additionally, a distributed-solve high-performance computing (HPC) capability has been added that allows engineers to analyze process variations within a full signal integrity (SI) analysis across a network of computers. For radio frequency (RF) and microwave design, Ansoft Designer 5.0 with Nexxim 5.0 feature...

Ansoft HFSS Version 12.1.1 Defect Fixes===========================ANSft00092904 – HFSS provided erroneous results when an analysis switched from a domain solution to a non-domain solution in subsequent passes. This patch corrects the issue.ANSft00092339 – Far-fields will now be computed correctly when the radiation setup only includes a single angle or pattern slice.ANSft00093260 – The mesher will no longer fail when it encounters empty facets in the mesh. ANSft00093023 – This patch addresses a memory leak in the far-fields post processor that caused the software to crash in some cases.ANSft00093768 – Users can now set up Remote Simulation Manager on SUSE 11 computers.ANSft00092757 – Distributed interpolating sweeps in HFSS-IE designs could sometimes produce non-causal S-parameters. This issue is fixed in the patch.ANSft00090666 –...

ANSYS, Inc. (NASDAQ: ANSS), a global innovator of simulation software and technologies designed to optimize product development processes, today announced the 12.1 release of HFSS(TM) software, the industry-leading technology for 3-D full-wave electromagnetic field simulation. The product introduces a new integral equation (IE) electromagnetic solver option, which is based on 3-D full-wave method of moments (MoM), that can be implemented in the HFSS desktop. This technology is effective for large-scale radiating and scattering simulation studies. For example, an aircraft system integrator interested in antenna placement or radar cross-section (RCS) studies can accurately simulate and design with the IE solver, effectively reducing prototype iterations, cost and time to market. HFSS software helps engineers design, simulate and validate the behavior of complex...

SIwave HeadingSignal- and Power-Integrity Analysis for High-Performance PCBs and IC Packages SIwave™ analyzes entire printed circuit boards (PCBs) and IC packages prevalent in modern electronic products. The software allows engineers to perform complete signal- and power- integrity analyses from DC to beyond 10 Gb/s. SIwave extracts frequency-dependent circuit models of signal nets and power distribution networks directly from electrical CAD layout (E-CAD) databases. These analyses aid in the identification of signal and power-integrity problems and are critical to designers seeking first-pass system success. Entire design paths from package to board to package can be analyzed using a full-wave electromagnetic simulator realizing coupling effects between packages and boards that are often ignored. With an IC die network modeler, first order silicon...

::::::English Description:::::: AnsoftLinks 4.2 streamlines the transfer of design databases from popular third-party EDA layout tools and Mechanical CAD (MCAD) packages into Ansoft electromagnetic field simulation products. EDA links are available for a number of tools offered by Cadence, Zuken, Mentor Graphics and Synopsys, while MCAD links support common file formats, such as IGES, STEP and Pro/E. With AnsoftLinks, select components or complete IC, package, printed circuit board and connector designs can be automatically converted into ready-to-simulate Ansoft models, allowing engineers to use existing design geometries in their electromagnetic analyses in order to meet aggressive product:Ansoft Links 4.2 Lanaguage:english Platform:Winxp/Win7 Size:43MB

Ansoft Designer® is an integrated schematic and design management front-end for Ansoft\’s best-in-class simulation technologies, HFSS™, Q3D Extractor®, and SIwave™. Ansoft Designer is the foundation for a highly accurate design flow that allows users to precisely model and simulate complex analog, RF, and mixed-signal applications and perform signal-integrity analysis and system verification of high-performance IC/package/board designs. This flexible, easy-to-use software includes schematic capture and layout editing, netlist generation and sophisticated data visualization and analysis tools.product:Ansoft Designer v4.1.1;Nexxim v 4.1.1 Lanaguage:english Platform:Winxp/Win7 Size:882MB

=============================================HFSS is now able to export surface and volume losses in .xml file format for linking to an ANSYS Mechanical v12 thermal analysis. DXF files can now be imported with .tech layer mapping files. ANSft00084239 – Users can now run a non-graphical batchsolve of an analysis that                 requires a datalink between designs.  Version 11.1.3 Bug Fixes========================ANSft00083110 – Data table reports will now load more efficiently.ANSft00083445 – Port field lines now honor the calibration line defined on the port in                 cases where the mesh is copied from another solution.ANSft00083190 – Expressions for excitation phase that do not contain units will no longerbe assigned a constant value in degrees after saving and closing the project.ANSft00082977 – Triangle nodes could inadvertently...