Tags :ANSYS 17.0.2

ANSYS 17.0.2 Win64 Update OnlyANSYS 17.0 delivers solutions faster so engineers and designers can make more informed decisions sooner in the product development cycle. That enables organizations to rapidly innovate and bring products to market faster, while getting more productivity from their existing engineering assets. Through tighter integration of semiconductor and electronics simulation solutions, ANSYS 17.0 delivers a comprehensive chip-package-system design workflow. New capabilities for automated thermal analysis and integrated structural analysis deliver an unequalled chip-aware and system-aware simulation solution, enabling customers to deliver smaller, higher-power density devices to market faster. With the advent of the Internet of Things, more products and engineers will rely on these capabilities. In the fluids suite, ANSYS continues its technology leadership with breakthrough advancements...