Tags :C-Mold

C-MOLD Fusion eliminates the time consuming task of creating a midplane model in order to do analysis. C-MOLD Fusion works directly on a CAD model and allows users to simulate both the filling and packing stages of the injection molding process. The technology functions similarly to Moldflow’s flagship Plastics Insight product, and has now been extended to the recently acquired C-MOLD product. In addition, C-MOLD 2000.7 includes an underfill encapsulation module to simulate the increasingly popular thermosetting flip-chip encapsulation process. Flip-chip, a relatively new technology for microchip packaging, does not require wire or molding for the process. The chip is bonded directly on the pc-board or substrate — creating a smaller and denser envelope that connects to the board. \”The...