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ANSYS CTA 2019 R2.1

ANSYS CTA 2019 R2.1 Chip Package System Co-design Power integrity and signal integrity simulation for any IC should be performed with the proper noise model of the IC, along with the channel model of the package and board. ANSYS RedHawk for chip power modeling ANSYS RedHawk for chip signal modeling ANSYS RedHawk-CPA/SIwave for package modelling ANSYS RedHawk for chip thermal modeling ANSYS IcePak for system level thermal modeling chip-aware system and system-aware chip design, CPM, CTA, CTM, etc Product:ANSYS CTA 2019 R2.1 Lanaguage:english Platform:Win7/WIN10 Size:1CD

ANSYS CTA 2019 R2.1

ANSYS CTA 2019 R2.1 Chip Package System Co-design Power integrity and signal integrity simulation for any IC should be performed with the proper noise model of the IC, along with the channel model of the package and board. ANSYS RedHawk for chip power modeling ANSYS RedHawk for chip signal modeling ANSYS RedHawk-CPA/SIwave for package modelling ANSYS RedHawk for chip thermal modeling ANSYS IcePak for system level thermal modeling chip-aware system and system-aware chip design, CPM, CTA, CTM, etc Product:ANSYS CTA 2019 R2.1 Lanaguage:english Platform:Win7/WIN10 Size:1CD

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