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ETA dynaform 5.8

DYNAFORM 5.8 Released with Improved FunctionalityVersion Offers a Simplified INC Solver December 14, 2010—Engineering Technology Associates, Inc. (ETA) announces the release of DYNAFORM Version 5.8. DYNAFORM is a simulation software solution which analyzes the entire die system and allows organizations to bypass soft tooling, reducing tryout time, lowering costs, and improving cycle times and productivity. This latest release offers many new and improved features, as well as enhanced Pre- and Post-Processing capabilities for a more streamlined and robust user experience. Possibly the most notable addition in this version is the availability of a new explicit incremental INC Solver to support rapid die face design and analysis of formability concerns. The INC Solver offers a value solution for customers who are...

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