Tags :Mentor.Graphics.Calibre.2020.tutorials

Mentor.Graphics.Calibre.2020.3.16.11 For linux The next few IC technology nodes will be more challenging than any other transition since the first integrated circuit. Until the 32 nm node, distortions involved in making the masks using 193 nm lithography were small and had little impact since mask features are four times larger than the actual features on a die. Traditional OPC has mainly addressed the wafer image transfer and only included mask making effects as a part of the overall OPC model.  But at 32/22 nm, mask fabrication is subject to the same imaging limitations that have affected wafer lithography since the 130 nm node. Areas of particular sensitivity include narrow features and corners, residual proximity and linearity effects due to etch...