Tags :PakSi-E

::::::English Description:::::: PakSi-E is a versatile 3D quasi-static electromagnetic simulation tool for electronic packaging. With this userfriendly tool, engineers and designers can address and resolve electrical performance issues in their IC packaging designs in a timely manner. PakSi-E is the only 3D quasi-static extraction tool on the market that provides whole package RLGC parasitic extractions. As shown in the above figure, small features like wires, vias, solder balls and pads must be modeled in a 3D model to generate accurate high requency SPICE subcircuits.Even though 3D modeling is essential to high frequency simulation, many competing products on the market still use the less accurate 2D or 2.5D for whole package extraction because of the technical challenges associated with 3D modeling. With...