Si9000e supports roughness for both drum and treated side copper The Si9000e PCB controlled impedance frequency-dependent boundary element field solver combines powerful impedance calculation over a wide range of structures and unprecedented ease of use: Links with Speedstack as Speedstack Si Inbuilt impedance graphing Graphs conductor, dielectric and insertion loss At-a-glance comprehensive S-parameter charting — magnitude, phase and Smith charts Single-ended and Mixed-mode S-parameters charting and data tables User defined S-parameter source and termination impedance Frequency dependent modeling down to 1KHz Go/no go via stub check. With its fast, accurate, frequency-dependent transmission line modeling, the new Si9000e is designed to model transmission line loss, impedance at given frequencies and extract full transmission line parameters over a wide range of popular...
Polar Instruments Si9000 is one of the most important tools for anyone working on high speed digital designs. The software is aimed at estimating trace impedance and can help simulate loss less trace impedance as well as analyse how trace impedance would change based on the frequency of interest. There are a number of built in PCB layer stack-up configurations available within the tool and all the user needs to do is to enter relevant data for a chosen stack-up and click the calculate button. The calculated database can be saved and retrieved at a later time, making it non-repetitive. Almost all possible trace configurations are built in along with a XFE option which enables hashing of ground planes. Possible...
Speedstack includes: New: Virtual Materials ModeImpedance goal seekIPC slash sheet supportCustomisable report writerStacked via supportStacked microvia supportEnhanced thickness calculationEnhanced rules checkLink to Si8000m / Si9000eOutput to .jpg formatSaving impedance data in .sci fileOutput to Gerber DXF and moreSupport for MicroviaMaterial library importSupport for additional material types10x faster than traditional methods Save time PCB stackup documentation and control consumes an increasing amount of time for both interconnect designers and PCB front-end engineers. Layer build is shared using an easy to read standard format: .sci For fabricators: Now you can document layer stackup rapidly and professionally. Share material types and key stackup related information both within your facility and with your clients. For interconnect engineers: At a glance viewing of layer stackup,...
Speedstack includes: New: Virtual Materials ModeImpedance goal seekIPC slash sheet supportCustomisable report writerStacked via supportStacked microvia supportEnhanced thickness calculationEnhanced rules checkLink to Si8000m / Si9000eOutput to .jpg formatSaving impedance data in .sci fileOutput to Gerber DXF and moreSupport for MicroviaMaterial library importSupport for additional material types10x faster than traditional methods Save time PCB stackup documentation and control consumes an increasing amount of time for both interconnect designers and PCB front-end engineers. Layer build is shared using an easy to read standard format: .sci For fabricators: Now you can document layer stackup rapidly and professionally. Share material types and key stackup related information both within your facility and with your clients. For interconnect engineers: At a glance viewing of layer stackup,...
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