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Mentor Graphics Design Capture-Expedition Flow 2007.5 Win32 为完成高密度PCB 与薄膜MCM 的布局、分析与生产提供最具生产力的工具。为最大限度地提高生产能力，用户可迅速、简便地访问所有基本设计工具。在能快速完成100%布线的编辑环境中，即使设定了最苛刻的规则，Expedition PCB Pinnacle 也可保证用户在板上集成所有器件。Expedition PCB Pinnacle 不断被证明是独一无二的最佳工具。得到用户所需的竞争能力、快速上市时间及最大的生产能力Expedition PCB 的界面可完全由用户定义，避免了由于工具的繁琐而给生产带来的阻碍。用户可根据自己的需要以图形方式对Expedition PCB 的下拉菜单、图标工具栏、功能键及快捷键进行定义。从设计环境中去除不常用的命令，可获得最高的生产效率。工具间通讯能力保证设计计划按正确方向发展Expedition PCB 通过ITC(工具间通讯)与Design Capture 紧密集成。ITC 保证Design Capture 与Expedition PCB 数据库总保持同步，并在任何环境中发生修改时通知系统工程师或PCB 设计者。随着项目由概念转向最终产品，原理图与PCB 不匹配的危险被降至最低，同时也避免了不必要的、价格昂贵的重复设计。有了ITC，所有设计人员均使用当前数据进行工作，从而避免了推迟上市时间及PCB 生产与原始设计脱节等问题。良好的工具间集成可使多个设计人员同时对电路的不同部分进行定义、仿真及设计，从而提高了设计的可靠性与生产效率。布局/布线—- 目前世界上功能最强的布线器在进行器件布局、布线时，Mentor Graphics 的高级编辑器无疑是最佳环境。交互与自动模式均采用最新技术实现可生产的高质量印刷电路版设计。信号规则和限制条件从电路的设计输入阶段传递过来，保证首次即正确布线。为在投产前完成修改，只需打开自动布线器的动态推挤选项。采用这一全自动、高级的布局、布线工具，用户将获得无以伦比的能力，以最高的效率完成设计工作。享有盛誉的交互、批处理自动布线器由于采用基于形状的无网格布线技术，Expedition PCB 提供了更高的性能与布通率，为得到较高的效益，用户可根据生产需要制定设计规则。片刻完成“最后一分钟修改”   Mentor Graphics Design Capture-Expedition Flow 2007.5 Win32 is a state-of-the-art front-end design package. Driving a full suite of digital and analog simulation and design tools, Design Capture enables you to rapidly and easily realize your design concepts, bringing them to life faster, and more accurately and profitably than ever before. Design Capture gives you the freedom to use traditional schematic-based entry with methods that are already familiar and comfortable to you. During creation, designs may be partitioned into various functional blocks and...

TINA v8 and TINA Design Suite v8 are upgrades of the earlier programs, TINA for Windows, TINA Plus for Windows and TINA PRO 5.0 5.5, 6.0 and 7.0 already in wide use throughout the world. New features of TINA v8 and TINA Design Suite v8 TINA v8 • Vista style installation and folder scheme• Behavioral building blocks, nonlinear controlled sources• Powerful Spice-VHDL co-simulation including MCUs• Finite State Machine (FSM) editor with VHDL generation• Flowchart editor and debugger for controlling MCUs (in v8.0 for PIC MCUs only)• Any number of MCUs in one circuit• Extended MCU catalog including PIC18, CAN and more• Execution time measurement and statistics for Transient Analysis• Hyperlinks can be added to schematics and to the diagram window•...

The Cadence® rF SiP Methodology Kit accelerates the application of eDAtechnologies to system-in-package (SiP) designs for radio Frequency(rF) and wireless applications. it provides methodologies that maximizedesign productivity and predictability for customers leveraging theadvantages of SiP technology. An integrated set of products built aroundproven methodologies enables complete front-to-back SiP design andimplementation. All this is demonstrated on a segment representativedesign, resulting in reduced time to new products, increased functionaldensities, and higher system performance.CADENCE SIP DESIGN TECHNOLOGYCADENCE RF SIP METHODOLOGY KITManufacturers of high-performance consumer electronics areThe Cadence rF SiP Methodology Kit leverages new SiPturning to SiP design because it can provide a number oftechnologies and verified advanced methodologies for rF SiPadvantages over just SoC. in addition to reduced cost, lowerdesign. it enables wireless...