Polar_Instruments_Speedstack_2013
Speedstack includes: New: Virtual Materials ModeImpedance goal seekIPC slash sheet supportCustomisable report writerStacked via supportStacked microvia supportEnhanced thickness calculationEnhanced rules checkLink to Si8000m / Si9000eOutput to .jpg formatSaving impedance data in .sci fileOutput to Gerber DXF and moreSupport for MicroviaMaterial library importSupport for additional material types10x faster than traditional methods Save time PCB stackup documentation and control consumes an increasing amount of time for both interconnect designers and PCB front-end engineers. Layer build is shared using an easy to read standard format: .sci For fabricators: Now you can document layer stackup rapidly and professionally. Share material types and key stackup related information both within your facility and with your clients. For interconnect engineers: At a glance viewing of layer stackup,...