Sigrity SpeedXP V12.0.2
Sigrity’s newly released PowerSI can be used to: • Perform pre-layout and post-layout electrical analyses • Extract frequency-dependent impedances of power and ground systems of any number of layers and complex structures • Optimize decoupling capacitor placement • Identify package and board resonance • Analyze signal return path discontinuities • Evaluate electromagnetic coupling between different components (planes, traces, and vias) • Determine frequency-dependent S, Z and Y network parameters • Perform what-if comparisons to optimize electrical performance Broadband SPICE™, a new software module planned for release in Q2 of 2002, provides the transformation of S-parameters to broadband SPICE circuits, which can subsequently be used by conventional circuit solvers such as HSPICE. Components The SpeedXP tool suite includes SPEED2000, PowerSI, interfaces...