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Siemens FiberSIM 13.0.0 (CATIA V5 R18-R22)Siemens PLM Software has presented FiberSIM 13. Enhancements in this release can help industries that use composite materials in their products reduce design and analysis time by up to 80% and shorten some design for manufacturing processes by up to 50%. About Siemens FiberSIM 13 Fibersim 13 is an offering of Siemens’ product lifecycle management (PLM) software business unit. Version 13 adds new functionality for bi-directional exchange of computer-aided engineering (CAE) and CAD data that facilitates the elimination of data re-entry. The new capability directly integrates analysis data into the design environment, enabling automatic design updates based on analysis results. It also provides new design-for-manufacturing processes that support optimization for parts designed to match the...

Intergraph CADWorx (Plant, P&ID, Equipment, IP, SpecEditor) 2017.01CADWorx Plant Design Suite®: the most complete range of tools for efficient plant design The Intergraph CADWorx Plant Design Suite is an integrated, complete software series for plant design that provides intelligent drawing and database connectivity, advanced levels of automation and easy-to-use drafting tools. The comprehensive series of design tools include structural steel, equipment, process and instrument diagrams, and design review, plus automatic isometrics and bills of material. CADWorx is quick and easy to set up and use, so you can start designing right away. CADWorx Plant is also integrated with the Intergraph’s Analysis solutions: CAESAR II® for Pipe Stress Analysis, and PV Elite™ for the Analysis and Design of pressure vessels and...

Intergraph CADWorx (Plant, P&ID, Equipment, IP, SpecEditor) 2017.01CADWorx Plant Design Suite®: the most complete range of tools for efficient plant design The Intergraph CADWorx Plant Design Suite is an integrated, complete software series for plant design that provides intelligent drawing and database connectivity, advanced levels of automation and easy-to-use drafting tools. The comprehensive series of design tools include structural steel, equipment, process and instrument diagrams, and design review, plus automatic isometrics and bills of material. CADWorx is quick and easy to set up and use, so you can start designing right away. CADWorx Plant is also integrated with the Intergraph’s Analysis solutions: CAESAR II® for Pipe Stress Analysis, and PV Elite™ for the Analysis and Design of pressure vessels and...

Mentor Graphics FloTHERM XT v3.0FloTHERM XT is a unique, award-winning thermal simulation solution that can be used during all stages of the electronics design process – from conceptual design to manufacturing – improving product quality, reliability and time-to-market. Aerospace & Defense Restricted design space and complexity of aerospace and defense electronics require accurate handling of the geometry and high result accuracy. It provides the solution to detailed electronics cooling simulation but quick project definition and simulation of high reliability products: Detailed component to enclosure simulation Fast and automatic meshing and solving High-accurate result for critical electronic systems Automotive Advancements in automotive electronics are often limited by design space and contain design-driven shapes. FloTHERM XT offers not only an extensive range...

Speedstack includes: New: Virtual Materials ModeImpedance goal seekIPC slash sheet supportCustomisable report writerStacked via supportStacked microvia supportEnhanced thickness calculationEnhanced rules checkLink to Si8000m / Si9000eOutput to .jpg formatSaving impedance data in .sci fileOutput to Gerber DXF and moreSupport for MicroviaMaterial library importSupport for additional material types10x faster than traditional methods Save time PCB stackup documentation and control consumes an increasing amount of time for both interconnect designers and PCB front-end engineers. Layer build is shared using an easy to read standard format: .sci For fabricators: Now you can document layer stackup rapidly and professionally. Share material types and key stackup related information both within your facility and with your clients. For interconnect engineers: At a glance viewing of layer stackup,...

Speedstack includes: New: Virtual Materials ModeImpedance goal seekIPC slash sheet supportCustomisable report writerStacked via supportStacked microvia supportEnhanced thickness calculationEnhanced rules checkLink to Si8000m / Si9000eOutput to .jpg formatSaving impedance data in .sci fileOutput to Gerber DXF and moreSupport for MicroviaMaterial library importSupport for additional material types10x faster than traditional methods Save time PCB stackup documentation and control consumes an increasing amount of time for both interconnect designers and PCB front-end engineers. Layer build is shared using an easy to read standard format: .sci For fabricators: Now you can document layer stackup rapidly and professionally. Share material types and key stackup related information both within your facility and with your clients. For interconnect engineers: At a glance viewing of layer stackup,...