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::::::English Description::::::   The TriForma Extension for MicroStation provides the building and plant industries with a common technology platform for architectural and engineering design. This 3D, solids modeling software provides a robust set of capabilities for object management, geometric modeling, drafting, information and standards management, visualization, drawing and report extraction, integration with analytical tools, and interference review. TriForma improves communication and coordination by laying the foundation for a suite of discipline-specific applications that address the needs of the many fields involved in a building or plant engineering project; resulting in faster, better, more cost-effective projects. Product:Bentley Microstation Triforma XM 08.09.04.63 Lanaguage:english Platform:Winxp/Win7 Size:100MB

::::::English Description:::::: Super Finsim is the best choice for large Verilog simulation capacity. It offers an excellent price/performance ratio and robust integration with third party software. Features: Best choice for large farms for Verilog simulation Supports the entire Verilog language, user defined primitives, specify blocks, system tasks and functions, PLI 1.0, VCD and SDF. Supports compiled, interpreted, and any mixture of compiled and interpreted simulation First mixed event and cycle driven simulator for Verilog Smart partitioner analyzes the design and decides which areas can be simulated by the Enhanced Cycle Simulation (ECS) kernel Able to handle modules with path delays as well as some RTL-level modules, and fully supports Xs and Zs as well as the entire range of Verilog...

::::::English Description::::::Super Finsim is the best choice for large Verilog simulation capacity. It offers an excellent price/performance ratio and robust integration with third party software. Features: Best choice for large farms for Verilog simulation Supports the entire Verilog language, user defined primitives, specify blocks, system tasks and functions, PLI 1.0, VCD and SDF. Supports compiled, interpreted, and any mixture of compiled and interpreted simulation First mixed event and cycle driven simulator for Verilog Smart partitioner analyzes the design and decides which areas can be simulated by the Enhanced Cycle Simulation (ECS) kernel Able to handle modules with path delays as well as some RTL-level modules, and fully supports Xs and Zs as well as the entire range of Verilog strengths....

::::::English Description:::::: ArcView is full-featured geographic information system (GIS) software for visualizing, managing, creating, and analyzing geographic data. Using ArcView, you can understand the geographic context of your data, allowing you to see relationships and identify patterns in new ways. ArcView helps tens of thousands of organizations make better decisions and solve problems faster. Key Features Quality Mapping Author maps using simple wizards and an extensive suite of map elements. Use predefined map templates that save you time and make it easy to create a consistent style in your maps. Create interactive maps from file, database, and online sources. Create interactive maps that link nonspatial data to specific locations. Create interactive maps that allow you to access a wide variety...

About IC-CAPIC-CAP (integrated circuitcharacterization and analysisprogram) is device modelingsoftware that provides powerfulcharacterization and analysiscapabilities for today’s semiconduc-tor modeling. IC-CAP offers deviceengineers and designers a state-of-the-art modeling tool that fillsnumerous modeling needs, includ-ing instrument control, data acquisi-tion, parameter extraction, graphicalanalysis, simulation, optimization,and statistical analysis. All of thesecapabilities are combined in aflexible, automated, and intuitivesoftware environment for efficientand accurate extraction of activedevices and circuit model param-eters. IC-CAP provides the power tobuild model libraries for AdvancedDesign System (ADS) or other com-mercial simulators.Features at a glance• complete automated hardware and• efficient, open and flexible softwaresoftware integrationenvironment and extraction• fast links to ADS simulatorsmethodologies• unique boundary models for realistic• DC to RF extraction routines forworst-case modelingstate-of-the-art industry standard models• worldwide training and support• unique nonlinear...

p> ::::::English Description:::::: VariCAD 2007 v3.00 Linux Rpm package is a 3D/2D CAD system for mechanical engineering. In addition to standard tools for 3D modeling and 2D drafting, the CAD system provides tools for sheet metal unbending and crash tests, assembly support, libraries of standard mechanical parts (ANSI, DIN) and symbols, mechanical part calculations and tools for working with bills of materials (BOM) and title blocks. VariCAD supports STEP, STL, IGES, DWG and DXF file formats. The comprehensive CAD software enables designers to quickly create, evaluate, and modify their models. It is compact, fast, easy to use, and provides everything one needs for mechanical design. The CAD system is sold fully loaded, including all features and functions, for one affordable...

WinCC flexible is ideal for use as the HMI software in all applications in which operator control and monitoring is required on site – whether in production and process automation.WinCC flexible is designed on a non-industry specific basis and it offers Engineering Software for SIMATIC HMI operator control and monitoring devices from the smallest Micro Panel up to PCs as well as Runtime Visualization Software for single-user solutions under Windows 2000 / XP. In this connection, you can transfer projects to different HMI platforms and run them there without needing to convert the projects.Compatible application of complete ProTool projects for Windows-CE-based devices means that you can use all your previous engineering effort using WinCC flexible, which secures your investment. In...

Advanced Design System is the leading electronic design automation software for RF, microwave, and signal integrity applications. ADS pioneers the most innovative and commercially successful technologies, such as X-parameters* and 3D EM simulators, used by leading companies in the wireless communication & networking and aerospace & defense industries. For WiMAX™, LTE, multi-gigabit per second data links, radar, & satellite applications, ADS provides full, standards-based design and verification with Wireless Libraries and circuit-system-EM co-simulation in an integrated platform.Key Benefits of ADS * Complete, integrated set of fast, accurate and easy-to-use system, circuit & EM simulators enable first-pass design success in a complete desktop flow * Application-specific DesignGuides encapsulate years of expertise in an easy-to-use interfaceProduct:Agilent Advanced Design System ADS 2006A Linux...

The trend toward smaller device geometries has increased IC functionality and speed. With smaller dies, heat dissipation and the thermal characteristics of the package play a significant role in chip reliability. More and more the critical factor in determining IC reliability is not the IC itself but the package. At the system level reliability depends on matching the thermal expansion properties ofthe die, interconnects, package, and the PWB to avoid thermal differential expansion due to internal or external temperature changes.Package engineers must also consider thermal and mechanical stresses associated with the manufacturing process in order to reduceany manufacturing induced defects. During the solder re-flow operation temperatures in excess of 220°C are realized. This high temperature, combined with moisture absorption in...

::::::English Description:::::: PakSi-E is a versatile 3D quasi-static electromagnetic simulation tool for electronic packaging. With this userfriendly tool, engineers and designers can address and resolve electrical performance issues in their IC packaging designs in a timely manner. PakSi-E is the only 3D quasi-static extraction tool on the market that provides whole package RLGC parasitic extractions. As shown in the above figure, small features like wires, vias, solder balls and pads must be modeled in a 3D model to generate accurate high requency SPICE subcircuits.Even though 3D modeling is essential to high frequency simulation, many competing products on the market still use the less accurate 2D or 2.5D for whole package extraction because of the technical challenges associated with 3D modeling. With...